منابع مشابه
An Optimal Partition between On-Chip and On-Board Interconnects
An optimal partition between on-chip and on-board interconnects is proposed, which achieves the highest possible global clock frequency as well as high wiring density. A general model is developed for adequate number and size of repeaters and the impact of this model on optimal partition of interconnects is also studied. Using on-board wires the global clock frequency of a projected system-on-a...
متن کاملFast Electromagnetic Modeling of 3D Interconnects on Chip-package-board
The goal of this paper is twofold: to give a brief review of the latest research progress on electromagnetic modeling of vertical interconnects by using Foldy-Lax multiple scattering technique, to introduce a fast full-wave interconnect simulator, namely Foldy-Lax Via Tool, integrating all the extensions that recently have been made available. The kernel part of this novel approach is a mostly ...
متن کاملA Neurocomputer Board Based on the ANNA Neural Network Chip
A board is described that contains the ANN A neural-network chip, and a DSP32C digital signal processor. The ANNA (Analog Neural Network Arithmetic unit) chip performs mixed analog/digital processing. The combination of ANNA with the DSP allows high-speed, end-to-end execution of numerous signal-processing applications, including the preprocessing, the neural-net calculations, and the postproce...
متن کاملHigh Speed Neural Network Chip on PCI-Board
A novel neural chip SAND (Simple Applicable Neural Device) is described. It is highly usable for massive parallel neural network computations. The chip is optimized for a high input data rate (50 MHz, 16 bit data) at a very low cost basis. The performance of a single SAND chip is 200 MOPS due to four parallel 16 bit multipliers and 40 bit adders working in one clock cycle. The chip is able to i...
متن کاملEffects of Underfill Delamination and Chip Size on the Reliability of Solder Bumped Flip Chip on Board
An investigation on the solder bumped Flip Chip on Printed Circuit Board (FCOB) is presented in this paper. The emphasis is placed on the effects of delamination crack between the underfill encapsulant and the solder mask on the solder joint reliability of FCOB. In the present study, a fracture mechanics approach is employed. The strain energy release rate at the crack tip between the underfill...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Circuit Technology
سال: 1990
ISSN: 1884-118X,0914-8299
DOI: 10.5104/jiep1986.5.143